Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or cracking
US8847391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2013 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Feb 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some exemplary embodiments of this disclosure pertain to a semiconductor package that includes a packaging substrate, a die and a set of under bump metallization (UBM) structures coupled to the packaging substrate and the die. Each UBM structure has a non-circular cross-section along its respective lateral dimension. Each UBM structure includes a first narrower portion and a second wider portion. The first narrower portion has a first width. The second wider portion has a second width that is greater than the first width. Each UBM structure is oriented towards a particular region of the die such that the first narrower portion of the UBM structure is closer than the second wider portion of the UBM structure to the particular region of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.