Dimensionally tolerant multiband conformal antenna arrays
US8847823B2 · kind B2 · utility
3Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2012 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Oct 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/28
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.