Power semiconductor module and power semiconductor module system
US8848381B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 14, 2012 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Aug 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor module includes an electrically conductive connecting element, an accommodating region, and a clamping element which can be brought from a first position into a second position. If the clamping element is situated in the first position, a connecting region of a module-external connecting conductor can be inserted into the accommodating region and be clamped to the power semiconductor module with the formation of an electrically conductive connection between the connection region and the connecting element. For this purpose, the clamping element is brought from the first position into the second position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.