Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US8852391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2010 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Mar 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1989
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.