Method of transferring thin film components and circuit board having the same
US8853544B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2012 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Sep 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0264
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.