Ryuichi Kondou
7Patents
2h-index
10Co-inventors
44Inventor score
Filing activity: Jan 22, 2008 → Aug 21, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9601350B2 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Electricity | 6 | Active |
| US10166749B2 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Emerging Cross-Sectional Technologies | 2 | Active |
| US9892843B2 | Laminated inductor | Electricity | 2 | Active |
| US7847469B2 | Micro-cantilever | Emerging Cross-Sectional Technologies | 2 | Active |
| US8853544B2 | Method of transferring thin film components and circuit board having the same | Electricity | 1 | Active |
| US10096418B2 | Laminated inductor | Electricity | 1 | Active |
| US10217557B2 | Laminated inductor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.