Patent · US Active

Air-release features in cavity packages

US8853839B2 · kind B2 · utility

65Cited by

8References

53Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Jia Gao · Winchester, US
Jicheng Yang · Newark, US
Shafi Saiyed · Lynnfield, US
Siu Lung Ng · Stoneham, US
Xiaojie Xue · Bedford, US

Key dates

Filing date	Oct 4, 2012
Grant date	Oct 7, 2014
Priority date	—
Expiry date	Oct 4, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.