Shafi Saiyed
3Patents
1h-index
7Co-inventors
33Inventor score
Filing activity: Oct 4, 2012 → Dec 4, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8853839B2 | Air-release features in cavity packages | Electricity | 65 | Active |
| US9731959B2 | Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same | Electricity | 1 | Active |
| US11702335B2 | Low stress integrated device package | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.