Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof
US8853855B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2012 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Oct 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive post on the substrate, the conductive post includes a vertical side; attaching an integrated circuit to the substrate; and forming an encapsulant including a molded cavity, the vertical side circumscribed by and exposed within the molded cavity from the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.