Room temperature bonding apparatus
US8857487B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2008 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Aug 2, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate. Further, the room temperature bonding apparatus can use the angle adjustment mechanism to change a direction of the first substrate such that the first substrate and the second substrate come into parallel contact with each other, and uniformly impose the larger load on a bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.