Kensuke Ide
29Patents
8h-index
40Co-inventors
75Inventor score
Filing activity: Nov 22, 1985 → May 9, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5892171A | Method of extending capability of music apparatus by networking | Physics | 72 | Expired |
| US7119268B2 | Portable telephony apparatus with music tone generator | Electricity | 51 | Expired |
| US6911592B1 | Portable telephony apparatus with music tone generator | Electricity | 30 | Expired |
| US7161081B2 | Portable telephony apparatus with music tone generator | Electricity | 24 | Expired |
| US7091410B2 | Apparatus and computer program for providing arpeggio patterns | Physics | 15 | Expired |
| US6967276B2 | Portable telephony apparatus with music tone generator | Electricity | 9 | Expired |
| US7531737B2 | Music processing apparatus and management method therefor | Physics | 8 | Active |
| US4719578A | Profiling control apparatus and control method thereof | Performing Operations; Transporting | 8 | Expired |
| US6429365B1 | Performance control apparatus and method capable of shifting performance style during performance | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7514624B2 | Portable telephony apparatus with music tone generator | Electricity | 6 | Expired |
| US9130000B2 | Wafer bonding device and wafer bonding method | Performing Operations; Transporting | 5 | Active |
| US6698982B2 | Machine tool | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9443711B2 | Room-temperature bonding apparatus | Electricity | 4 | Active |
| US4747734A | Profiling apparatus | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8936998B2 | Manufcaturing method for room-temperature substrate bonding | Electricity | 2 | Active |
| USRE38554E1 | Method of extending capability of music apparatus by networking | General | 2 | Expired |
| US7940263B2 | Curved-surface generating method and program, and three-dimensional shape processing apparatus | Physics | 2 | Active |
| US8906175B2 | Room temperature bonding apparatus | Emerging Cross-Sectional Technologies | 1 | Active |
| US9064910B2 | Bonding unit control unit and multi-layer bonding method | Performing Operations; Transporting | 1 | Active |
| US8857487B2 | Room temperature bonding apparatus | Emerging Cross-Sectional Technologies | 1 | Active |
| US10112376B2 | Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US10486263B2 | Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor device | Electricity | 0 | Active |
| US9005390B2 | Room temperature bonding apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US8602289B2 | Room temperature bonding using sputtering | Performing Operations; Transporting | 0 | Active |
| US8608048B2 | Room-temperature bonding method and room-temperature bonding apparatus including sputtering | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.