Light emitting diodes and associated methods of manufacturing
US8859305B2 · kind B2 · utility
1Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2010 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Dec 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
Abstract
Light emitting diodes and associated methods of manufacturing are disclosed herein. In one embodiment, a light emitting diode (LED) includes a substrate, a semiconductor material carried by the substrate, and an active region proximate to the semiconductor material. The semiconductor material has a first surface proximate to the substrate and a second surface opposite the first surface. The second surface of the semiconductor material is generally non-planar, and the active region generally conforms to the non-planar second surface of the semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.