Thermal matching in semiconductor devices using heat distribution structures
US8859337B2 · kind B2 · utility
34Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2010 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Oct 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/116
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein provide a chip, comprising a first device on a substrate and a second device on the substrate. The chip further comprises a heat distribution structure in thermal proximity to the first device and the second device, wherein the heat distribution structure is thermally isolated and reduces a thermal gradient between the first device and the second device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.