TEM sample preparation
US8859998B2 · kind B2 · utility
9Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2012 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Jan 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31745
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved method of preparing ultra-thin TEM samples that combines backside thinning with an additional cleaning step to remove surface defects on the FIB-facing substrate surface. This additional step results in the creation of a cleaned, uniform “hardmask” that controls the ultimate results of the sample thinning, and allows for reliable and robust preparation of samples having thicknesses down to the 10 nm range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.