Light-emitting device package having a molding member with a low profile, and method of manufacturing the same
US8860069B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 3, 2012 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | Dec 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.