Patent · US Active

Multi-die processor

US8860199B2 · kind B2 · utility

35Cited by

8References

16Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bryan Black · Austin, US
Nicholas Samra · Austin, US
M. Clair Webb · North Logan, US

Key dates

Filing date	Feb 4, 2009
Grant date	Oct 14, 2014
Priority date	—
Expiry date	Jul 16, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed are a multi-die processor apparatus and system. Processor logic to execute one or more instructions is allocated among two or more face-to-faces stacked dice. The processor includes a conductive interface between the stacked dice to facilitate die-to-die communication.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.