M. Clair Webb
10Patents
5h-index
19Co-inventors
63Inventor score
Filing activity: Sep 12, 1975 → Jan 26, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8860199B2 | Multi-die processor | Emerging Cross-Sectional Technologies | 35 | Active |
| US9685436B2 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Electricity | 21 | Active |
| US8519462B2 | 6F2 DRAM cell | Electricity | 16 | Active |
| US3986044A | Clocked IGFET voltage level sustaining circuit | Electricity | 12 | Expired |
| US10297592B2 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Electricity | 5 | Active |
| US10700039B2 | Silicon die with integrated high voltage devices | Electricity | 3 | Active |
| US11271010B2 | Multi version library cell handling and integrated circuit structures fabricated therefrom | Electricity | 1 | Active |
| US9721898B2 | Methods of forming under device interconnect structures | Electricity | 0 | Active |
| US12067338B2 | Multi version library cell handling and integrated circuit structures fabricated therefrom | Electricity | 0 | Active |
| US9490201B2 | Methods of forming under device interconnect structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.