Patent · US Active

Apparatus and method for terminating probe apparatus of semiconductor wafer

US8860450B2 · kind B2 · utility

2Cited by
22References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 1, 2012
Grant dateOct 14, 2014
Priority date—
Expiry dateMay 30, 2032

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2831
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.