Tool induced shift reduction determination for overlay metrology
US8860941B2 · kind B2 · utility
2Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2012 |
| Grant date | Oct 14, 2014 |
| Priority date | — |
| Expiry date | May 24, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
One embodiment relates to a method for semiconductor workpiece processing. In this method, a baseline tool induced shift (TIS) is measured by performing a baseline number of TIS measurements on a first semiconductor workpiece. After the baseline TIS has been determined, the method determines a subsequent TIS based on a subsequent number of TIS measurements taken on a first subsequent semiconductor workpiece. The subsequent number of TIS measurements is less than the baseline number of TIS measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.