High-temperature lead-free solder alloy
US8865062B2 · kind B2 · utility
1Cited by
0References
17Claims
0Family size
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Key dates
| Filing date | Aug 8, 2012 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Aug 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.