Planar cavity MEMS and related structures, methods of manufacture and design structures

US8865497B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• George A. Dunbar, III · South Burlington, US
• Zhong-Xiang He · South Burlington, US
• Jeffrey C. Maling · Grand Isle, US
• William J. Murphy · North Ferrisburgh, US
• Anthony K. Stamper · Williston, US

Key dates

• Filing date: Dec 20, 2010
• Grant date: Oct 21, 2014
• Expiry date: Aug 6, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/5313
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a lower wiring layer on a substrate. The method further includes forming a plurality of discrete wires from the lower wiring layer. The method further includes forming an electrode beam over the plurality of discrete wires. The at least one of the forming of the electrode beam and the plurality of discrete wires are formed with a layout which minimizes hillocks and triple points in subsequent silicon deposition.