William J. Murphy
58Patents
11h-index
92Co-inventors
81Inventor score
Filing activity: Jun 19, 1997 → Apr 12, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8921144B2 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Emerging Cross-Sectional Technologies | 49 | Active |
| US9041128B2 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Emerging Cross-Sectional Technologies | 30 | Active |
| US5993615A | Method and apparatus for detecting arcs | Electricity | 29 | Expired |
| US8865497B2 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Emerging Cross-Sectional Technologies | 26 | Active |
| US7662722B2 | Air gap under on-chip passive device | Electricity | 22 | Active |
| US8604618B2 | Structure and method for reducing vertical crack propagation | Electricity | 21 | Active |
| US6117771A | Method for depositing cobalt | Electricity | 21 | Expired |
| US6534394B1 | Process to create robust contacts and interconnects | Electricity | 17 | Expired |
| US7056820B2 | Bond pad | Electricity | 12 | Expired |
| US6387790B1 | Conversion of amorphous layer produced during IMP Ti deposition | Electricity | 11 | Expired |
| US7282404B2 | Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme | Electricity | 11 | Expired |
| US6184132A | Integrated cobalt silicide process for semiconductor devices | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7166904B2 | Structure and method for local resistor element in integrated circuit technology | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6245668A | Sputtered tungsten diffusion barrier for improved interconnect robustness | Electricity | 8 | Expired |
| US9171971B2 | Encapsulated sensors | Emerging Cross-Sectional Technologies | 7 | Active |
| US7994895B2 | Heat sink for integrated circuit devices | Emerging Cross-Sectional Technologies | 6 | Active |
| US8230586B2 | Method of cooling a resistor | Emerging Cross-Sectional Technologies | 4 | Active |
| US7687867B2 | Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme | Electricity | 4 | Active |
| US8395196B2 | Hydrogen barrier liner for ferro-electric random access memory (FRAM) chip | Electricity | 4 | Active |
| US8586466B2 | Electrical fuse with a current shunt | Electricity | 3 | Active |
| US8052799B2 | By-product collecting processes for cleaning processes | Electricity | 3 | Active |
| US8796044B2 | Ferroelectric random access memory with optimized hardmask | Electricity | 3 | Active |
| US8881379B2 | Method of making heat sink for integrated circuit devices | Emerging Cross-Sectional Technologies | 3 | Active |
| US6882052B2 | Plasma enhanced liner | Electricity | 3 | Expired |
| US8003536B2 | Electromigration resistant aluminum-based metal interconnect structure | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.