Lid attach process
US8865527B2 · kind B2 · utility
3Cited by
27References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2013 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Jul 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.