Patent · US Active

Semiconductor packages and methods of formation thereof

US8866274B2 · kind B2 · utility

5Cited by

22References

46Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hermann Gruber · Leverkusen, DE
Joachim Mahler · Regensburg, DE
Uwe Hoeckele · Regensburg, DE
Anton Prueckl · Schierling, DE
Thomas Fischer · Umkirch, DE
Matthias Schmidt · Munich, DE

Key dates

Filing date	Mar 27, 2012
Grant date	Oct 21, 2014
Priority date	—
Expiry date	Sep 11, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die. The first die is attached with the deposited dielectric liner layer to a die paddle of a substrate. A bond layer is disposed between the substrate and the dielectric liner layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.