Two-phase, water-based immersion-cooling apparatus with passive deionization
US8867209B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2011 |
| Grant date | Oct 21, 2014 |
| Priority date | — |
| Expiry date | Jun 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment. Transferred heat is subsequently conducted to, for example, a liquid-cooled cold plate or an air-cooled heat sink coupled to the housing for cooling the condenser structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.