Flip chip assembly apparatus employing a warpage-suppressor assembly
US8870051B2 · kind B2 · utility
9Cited by
48References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2012 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | May 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.