Semiconductor manufacturing process module
US8870514B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2012 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Sep 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor handling system including a vacuum workpiece handling system having a vacuum environment therein, the vacuum workpiece handling system including at least two workpiece handling robotic facilities, a mid-entry station positioned between the at least two workpiece handling robotic facilities, the mid-entry station including vertically stacked load locks, where the at least two workpiece handling robotic facilities are configured to transfer workpieces between the vertically stacked load locks, at least one workpiece loading station connected to the vacuum handling system, and a workpiece delivery system having an internal environment different from the vacuum environment, the workpiece delivery system being configured to transport the workpieces between each of the vertically stacked load locks of the mid-entry station and the at least one workpiece loading station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.