Microelectromechanical device packaging with an anchored cap and its manufacture
US8871606B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 24, 2006 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Aug 5, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00238
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Integrated circuit (1) comprising a substrate (2), an active component (13) above the substrate (2), a cavity (14) surrounding partially the active component (13), a low dielectric region (15) surrounding partially the cavity (14) and a protective barrier (16) arranged around the low dielectric region (15).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.