Inventor · Toulouse, FR

Laurent-Georges Gosset

14Patents
5h-index
9Co-inventors
51Inventor score

Filing activity: Feb 18, 2004 → May 6, 2010

Most-cited inventions

PatentTitleAreaCited byStatus
US7172980B2 Process for fabricating an integrated electronic circuit that incorporates air gaps Electricity 32 Expired
US8470685B2 Integration of self-aligned trenches in-between metal lines Electricity 14 Active
US7936563B2 On-chip interconnect-stack cooling using sacrificial interconnect segments Electricity 11 Active
US8138082B2 Method for forming metal interconnects in a dielectric material Electricity 6 Active
US8097949B2 Control of localized air gap formation in an interconnect stack Electricity 6 Active
US8110879B2 Controlling lateral distribution of air gaps in interconnects Electricity 5 Active
US8399772B2 Control of carbon nanostructure growth in an interconnect structure Electricity 5 Active
US7605071B2 Controlling lateral distribution of air gaps in interconnects Electricity 2 Active
US8424177B2 MIM capacitor with enhanced capacitance Emerging Cross-Sectional Technologies 1 Active
US7553739B2 Integration control and reliability enhancement of interconnect air cavities Electricity 1 Active
US8143157B2 Fabrication of a diffusion barrier cap on copper containing conductive elements Electricity 1 Active
US7630191B2 MIM capacitor Electricity 0 Active
US7989342B2 Formation of a reliable diffusion-barrier cap on a Cu-containing interconnect element having grains with different crystal orientations Electricity 0 Active
US8871606B2 Microelectromechanical device packaging with an anchored cap and its manufacture Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.