Patent · US Active

Electronic device and method of manufacturing same

US8872335B2 · kind B2 · utility

2Cited by

1References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Holger Huebner · Neustadt an der Aisch, DE
Martin Franosch · Munich, DE

Key dates

Filing date	Jul 23, 2007
Grant date	Oct 28, 2014
Priority date	—
Expiry date	Jan 16, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

It is proposed a method of manufacturing an electronic system wherein a first substrate comprising first connection elements on a first surface of the first substrate is provided; a second substrate comprising second connection elements on a first surface of the second substrate is provided; a polymer layer is applied to at least one of the two first surfaces; the first connection elements are attached to the second connection elements; and the polymer layer is caused to swell during or after the attachment.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.