Interferometer for TSV measurement and measurement method using same
US8873067B2 · kind B2 · utility
19Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2012 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Apr 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided herein is a TSV measuring interferometer that uses a variable field stop that adjusts such that a light is focused at an inlet and at a bottom surface of a TSV when measuring a diameter and depth of the TSV, thereby reducing a measurement time and result data, the interferometer also using a telecentric lens that adjusts the light injected into the TSV to be a straight line, so as to obtain a sufficient amount of light reaching the bottom surface to improve the accuracy of measurement even in a TSV having a large aspect ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.