Patent · US Active

Method for stacking electronic components

US8873219B2 · kind B2 · utility

11Cited by
8References
30Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 26, 2012
Grant dateOct 28, 2014
Priority date—
Expiry dateSep 15, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/43
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.