Reggie Phillips
6Patents
4h-index
16Co-inventors
46Inventor score
Filing activity: Mar 26, 2010 → Jan 27, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8902565B2 | Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes | Emerging Cross-Sectional Technologies | 15 | Active |
| US9799449B2 | Multilayered ceramic capacitor with improved lead frame attachment | Emerging Cross-Sectional Technologies | 13 | Active |
| US8873219B2 | Method for stacking electronic components | Emerging Cross-Sectional Technologies | 11 | Active |
| US8331078B2 | Leaded multi-layer ceramic capacitor with low ESL and low ESR | Electricity | 6 | Active |
| US9847175B2 | Method for stacking electronic components | Emerging Cross-Sectional Technologies | 0 | Active |
| US10068708B2 | Method for stacking electronic components | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.