Substrate processing apparatus and method of manufacturing semiconductor device
US8876453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2011 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | May 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus suppresses vibration of a cover when unloading a boat from a process pipe. The apparatus comprises a boat for placing a substrate, a process pipe configured to accommodate the boat, a cover having the boat placed thereon, the cover configured to open and close a furnace port installed on a lower end of the process pipe, a motor to drive an elevation mechanism which moves the cover upward and downward, a sealing member to seal a space between the cover and the process pipe, and a controller to control motor speed and limit motor torque while the cover moves from the furnace port to a predetermined position. The substrate is maintained at a rest position in the boat during a recovery from a deformation of the cover occurring when separating the sealing member from the cover surface or the process pipe surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.