Patent · US Active

Method for the manufacture of double-sided metalized ceramic substrates

US8876996B2 · kind B2 · utility

1Cited by

7References

23Claims

0Family size

Assignee

IXYS Semiconductor GmbH · DE

Inventors

Werner Weidenauer · Lampertheim, DE
Thomas Spann · Ergolding, DE
Heiko Knoll · Marburg, DE

Key dates

Filing date	Jun 10, 2011
Grant date	Nov 4, 2014
Priority date	—
Expiry date	Apr 14, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/016
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.