Molded SiP package with reinforced solder columns
US8878346B2 · kind B2 · utility
0Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Jan 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.