Remote thermal compensation assembly
US8878435B2 · kind B2 · utility
1Cited by
3References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Oct 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B45/38
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.