Patent · US Active

High frequency probing structure

US8878560B2 · kind B2 · utility

10Cited by

10References

16Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Ying-Hsin Kuo · Zhubei City, TW
Wensen Hung · Zhubeikou, TW

Key dates

Filing date	Dec 30, 2010
Grant date	Nov 4, 2014
Priority date	—
Expiry date	Aug 7, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49167
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The present disclosure provide a probe card for wafer level testing. The probe card includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes various conductive lines having a first pitch on a first surface and a second pitch on a second surface, the second pitch being substantially less than the first pitch; a printed circuit board configured approximate the first surface of the space transformer; and a power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line of the space transformer to the printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.