Lithography projection objective, and a method for correcting image defects of the same

US8879159B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Ulrich Loering · Schwäbisch Gmünd, DE
• Vladan Blahnik · Aalen, DE
• Wilhelm Ulrich · Aalen, DE
• Daniel Kraehmer · Aalen, DE
• Norbert Wabra · Werneck, DE

Key dates

• Filing date: Sep 26, 2011
• Grant date: Nov 4, 2014
• Expiry date: Apr 16, 2032

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/7015
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The disclosure provides a microlithography projection objective which includes a plurality of optical elements along the optical axis of the projection objective. The plurality of optical elements includes a last optical element and a penultimate optical element. A distance between the last optical element and the penultimate optical element is variable. The disclosure also provides a microlithography projection exposure machine including such a projection objective, and a method of making semiconductor components using such a projection exposure machine.