Method of manufacturing semiconductor device, and wire bonder
US8881966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2009 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Jul 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/904
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature thereof may decrease stepwise. After wire bonding, cold air is blown from the cooling blower to the matrix frame, and temperature control of the matrix frame is performed so that the temperature of the matrix frame after wire bonding may decrease stepwise. Or, the wire-bonded matrix frame is fixed with a holding tool such as a frame holding member, a guide member, a roller means, or an elastic means until cooling is completed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.