Modular micro-fluid ejection head assembly
US8882221B2 · kind B2 · utility
0Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2008 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Mar 28, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.