Composition and method for polishing bulk silicon
US8883034B2 · kind B2 · utility
0Cited by
31References
18Claims
0Family size
Inventors
Key dates
| Filing date | Sep 16, 2009 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Aug 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02024
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increases the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.