Silicon etching liquid and etching method
US8883652B2 · kind B2 · utility
1Cited by
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9Claims
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Key dates
| Filing date | Sep 22, 2008 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | May 24, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00539
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A silicon etching liquid characterized by anisotropically dissolving monocrystalline silicon therein by using an aqueous solution containing a quaternary ammonium hydroxide and an aminoguanidine salt and an etching method of silicon using the instant etching liquid are an etching liquid and an etching method enabling one to perform processing at a high etching rate in etching processing of silicon, particularly in etching processing of silicon in a manufacturing process of MEMS parts or semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.