Patent · US Active

System in package and method for manufacturing the same

US8884343B2 · kind B2 · utility

4Cited by

4References

15Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Bernhard Lange · Gerolzhofen, DE
Juergen Neuhaeusler · Bad Aibling, DE

Key dates

Filing date	Feb 19, 2013
Grant date	Nov 11, 2014
Priority date	—
Expiry date	Feb 19, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system in package and a method for manufacturing the same is provided. The system in package comprises a laminate body having a substrate arranged inside a laminate body. A semiconductor die is embedded in the laminate body and the semiconductor is bonded to contact pads of the substrate by help of a sintered bonding layer, which is made from a sinter paste. Lamination of the substrate and further layers providing the laminate body and sintering of the sinter paste may be performed in a single and common curing step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.