Patent · US Active

Multichip device

US8884420B1 · kind B1 · utility

10Cited by

13References

20Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Khalil Hosseini · Weihmichl, DE
Joachim Mahler · Regensburg, DE
Ivan Nikitin · Regensburg, DE

Key dates

Filing date	Jul 12, 2013
Grant date	Nov 11, 2014
Priority date	—
Expiry date	Jul 12, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A multichip device includes a first semiconductor chip arranged over a first carrier and a second semiconductor chip arranged over a second carrier. The multichip device further includes an electrically conductive element electrically coupling the first semiconductor chip and the second semiconductor chip. The electrically conductive element includes a first exposed contact area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.