Inventor · Weihmichl, DE

Khalil Hosseini

84Patents
8h-index
52Co-inventors
77Inventor score

Filing activity: Aug 27, 2004 → Oct 1, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US9190389B2 Chip package with passives Electricity 12 Active
US7745913B2 Power semiconductor component with a power semiconductor chip and method for producing the same Electricity 12 Active
US7642641B2 Integrated circuit component with passivation layer Electricity 11 Active
US7368824B2 Diffusion solder position, and process for producing it Electricity 11 Expired
US8648456B1 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Electricity 11 Active
US8884420B1 Multichip device Electricity 10 Active
US9048338B2 Device including two power semiconductor chips and manufacturing thereof Electricity 10 Active
US7514778B2 Power semiconductor device Electricity 9 Expired
US8076238B2 Electronic device and method for production Electricity 7 Active
US7728415B2 Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same Electricity 7 Active
US8778733B2 Semiconductor package and methods of formation thereof Electricity 7 Active
US7632718B2 Semiconductor power component with a vertical current path through a semiconductor power chip Electricity 5 Active
US7834467B2 Layer between interfaces of different components in semiconductor devices Emerging Cross-Sectional Technologies 5 Active
US7781897B2 Semiconductor device and method for producing the same Electricity 4 Active
US7874475B2 Method for the planar joining of components of semiconductor devices and a diffusion joining structure Electricity 3 Active
US9021887B2 Micromechanical semiconductor sensing device Electricity 3 Active
US8552571B2 Electronic device and method for production Electricity 3 Active
US9171787B2 Packaged semiconductor device having an embedded system Electricity 3 Active
US8283756B2 Electronic component with buffer layer Electricity 3 Active
US9397018B2 Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit Electricity 3 Active
US7709938B2 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same Electricity 3 Active
US8039971B2 Electronic circuit arrangement Electricity 3 Active
US9093416B2 Chip-package and a method for forming a chip-package Electricity 2 Active
US9379050B2 Electronic device Electricity 2 Active
US8872315B2 Electronic device and method of fabricating an electronic device Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.