Fabrication of an inkjet printhead mounting substrate
US8887393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Jun 28, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of fabricating a mounting substrate forming an ink inlet in a first layer of a first dielectric; forming contact pads on a second layer of a second dielectric; forming a slot through the second layer; forming a window through a third layer of a third dielectric; aligning and laminating the second layer to the first layer such that the ink inlet is aligned with the slot; and aligning and laminating the third layer to the second layer so the contact pads and the slot are exposed through the window; providing a printhead die having: a drop mechanism for ejecting drops; a chamber to contain ink; and adhesively bonding the printhead die to the second layer so that the printhead die is disposed within the window and an inlet feed opening of the printhead die is aligned with the slot through the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.