Indium-containing lead-free solder for vehicle-mounted electronic circuits
US8888932B2 · kind B2 · utility
1Cited by
1References
10Claims
0Family size
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Key dates
| Filing date | Jul 17, 2008 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Jul 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3463
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided.The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.