Methods for surface attachment of flipped active componenets
US8889485B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 7, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Jun 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for selectively transferring active components from a source substrate to a destination substrate includes pressing a first stamp having first pillars protruding therefrom against active components on the source substrate to adhere respective primary surfaces of the active components including electrical connections thereon to respective transfer surfaces of the first pillars. A second stamp having second pillars protruding therefrom is pressed against the active components on the first stamp to adhere respective secondary surfaces of the active components to respective transfer surfaces of the second pillars. The transfer surfaces of the second pillars have greater adhesive strength than the first pillars. The second stamp is pressed against a destination substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to a receiving surface of the destination substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.