Semprius, Inc.
26Patents
26Active
26Granted
56Portfolio score
Filing activity: Jul 23, 2008 → Sep 9, 2015 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7927976B2 | Reinforced composite stamp for dry transfer printing of semiconductor elements | Performing Operations; Transporting | 332 | Active |
| US8722458B2 | Optical systems fabricated by printing-based assembly | Emerging Cross-Sectional Technologies | 324 | Active |
| US7999454B2 | OLED device with embedded chip driving | Electricity | 315 | Active |
| US8506867B2 | Printing semiconductor elements by shear-assisted elastomeric stamp transfer | Electricity | 306 | Active |
| US8889485B2 | Methods for surface attachment of flipped active componenets | Emerging Cross-Sectional Technologies | 298 | Active |
| US8877648B2 | Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby | Electricity | 247 | Active |
| US8261660B2 | Vacuum coupled tool apparatus for dry transfer printing semiconductor elements | Electricity | 172 | Active |
| US9161448B2 | Laser assisted transfer welding process | Emerging Cross-Sectional Technologies | 140 | Active |
| US8934259B2 | Substrates with transferable chiplets | Emerging Cross-Sectional Technologies | 138 | Active |
| US9412727B2 | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion | Electricity | 94 | Active |
| US9355854B2 | Methods of fabricating printable compound semiconductor devices on release layers | Emerging Cross-Sectional Technologies | 75 | Active |
| US9049797B2 | Electrically bonded arrays of transfer printed active components | Emerging Cross-Sectional Technologies | 63 | Active |
| US9165989B2 | High-yield fabrication of large-format substrates with distributed, independent control elements | Electricity | 62 | Active |
| US9117940B2 | Optical systems fabricated by printing-based assembly | Emerging Cross-Sectional Technologies | 49 | Active |
| US9142468B2 | Structures and methods for testing printable integrated circuits | Electricity | 30 | Active |
| US9496155B2 | Methods of selectively transferring active components | Electricity | 30 | Active |
| US9601671B2 | Optical systems fabricated by printing-based assembly | Emerging Cross-Sectional Technologies | 23 | Active |
| US9401344B2 | Substrates with transferable chiplets | Emerging Cross-Sectional Technologies | 22 | Active |
| US9307652B2 | Methods for surface attachment of flipped active components | Emerging Cross-Sectional Technologies | 22 | Active |
| US9660008B2 | High-yield fabrication of large-format substrates with distributed, independent control elements | Electricity | 5 | Active |
| US9040425B2 | Methods of forming printable integrated circuit devices and devices formed thereby | Electricity | 4 | Active |
| US9443883B2 | Methods of forming printable integrated circuit devices and devices formed thereby | Electricity | 4 | Active |
| US9362113B2 | Engineered substrates for semiconductor epitaxy and methods of fabricating the same | Electricity | 1 | Active |
| US8894754B2 | Breathing and desiccant regenerating cycle for reducing condensation in concentrator photovoltaic modules | Emerging Cross-Sectional Technologies | 1 | Active |
| US9603259B2 | Methods for surface attachment of flipped active components | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.